Ceramic Bga Package

Having a very high melting point this type bga requires c4 approach controlled collapse chip connection for making the bridge between bgas and pcbs.

Ceramic bga package.

An array of bare lands only. Ball grid array bga. In a bga the pins are replaced by pads on the bottom of the package each initially with a tiny solder ball stuck to it. As the name implies this is ceramic type bga.

Ball grid array bga ceramic pin grid array pga fineline bga fbga hybrid fineline bga hbga plastic dual in line package pdip plastic enhanced quad flat pack eqfp plastic j lead chip carrier plcc plastic quad flat pack pqfp power quad flat pack rqfp thin quad flat pack tqfp. In addition to alumina al 2 o 3 ceramics we produce aluminum nitride aln with high thermal conductivity 150w mk as well as low temperature co fired ceramic ltcc packages with high 12 3ppm k and low 3. 32 ball ceramic bga 6 85mm x 6 85mm x 3 8mm bg 32 3 pdf. Amkor flip chip bga fcbga packages are assembled around state of the art single unit laminate or ceramic substrates.

Flip chip hitce ltcc bga package kyocera provides both ceramic and organic packages for large scale integration lsi devices. Ceramic ball grid array package drawings bg view more. The bga is descended from the pin grid array pga which is a package with one face covered or partly covered with pins in a grid pattern which in operation conduct electrical signals between the integrated circuit and the printed circuit board pcb on which it is placed. Ceramic substrate 10sn 90pb solder balls 63sn 37pb solder ball to substrate attach 97pb 3sn c4 joint 0 89 mm solder ball for 1 27 mm pitch 1 27 mm pitch c4 c.

Fcbga flip chip bp flipchip ball grid array package drawings bp view. Utilizing multiple high density routing layers laser drilled blind buried and stacked vias and ultra fine line space metallization fcbga substrates have the highest routing density available. The solder balls have a 90 percent lead and 10 percent tin composition to increase reliability and overcome the issues of the differences between the thermal coefficients of expansion of the substrate and board. Available in the following packages.

Similar to in appearance to qfn but mating is by spring pins within a socket rather than solder. Package outline material information. The ration between tin and lead is 10 90 in this type. A square or rectangular array of solder balls on one surface ball spacing typically 1 27 mm 0 050 in land grid array lga.

Csp bga chip scale bc ca chip scale package ball grid array package drawings bc ca view more. Apply localized heat to bga package.