Ceramic Bga Reliability

Type 2 ceramic and plastic bga packages with nearly 600 i os.

Ceramic bga reliability.

Assemblies with water soluble flux were cleaned in an electrovert h500. Plastic bga pbga ceramic bga cbga pwb 63sn 37pb eutectic flip chip flip chip bga fcbga column cbga ccga 90pb 10sn high melt i o 600 i o 600. In addition the utilized ceramic ball grid array cbga. Ceramic ball grid array package drawings bg accept and proceed.

Also utilized was a 256 leaded and a 256 plastic bga package for evaluating and directly comparing manufacturing robustness and reliability. Typically these are packaged in organic or ceramic ball grid array bga packages which cover a wide range of package input output i o capabilities required for high performance devices. Bga package component reliability after long term storage r. Ceramic plates and printed circuit boards pcb to assess solder wetting.

Flip chip cbga is a common package for high end microprocessor devices. Incoming pcb requirements for cbga freescale semiconductor. Madsen abstract the white paper component reliability after long term storage texas instruments application. Ball grid array bga assembly reliability jpl nepp presentation ipc 9701 csp thermal cycle created date.

Shih et al reliability of hitce ceramic bga packages to be published 2005. Lower cte may be used to increase reliability. Balls for this package are 90 pb and 10 sn and attached to the ceramic substrate using eutectic 63sn 37pb solder paste. Flip chip hitce ltcc bga package kyocera provides both ceramic and organic packages for large scale integration lsi devices.

In addition to alumina al 2 o 3 ceramics we produce aluminum nitride aln with high thermal conductivity 150w mk as well as low temperature co fired ceramic ltcc packages with high 12 3ppm k and low 3. The cookies we use can be categorized as follows. Type 1 ceramic and plastic bga packages with nearly 300 i os. Substrate based ball grid array bga flip chip bga quad flat leadless stacked chip scale flip chip csp xuejun fan moisture related reliability xuejun fan lamar edu higher performance smaller size cheaper price chip scale and wafer level packaging csp wlp.