Ceramic Cavity Package

If saving time and reducing cost is important for your ceramic air cavity packages talk to one of our experts about the fully assembled ca pack package solution.

Ceramic cavity package.

Available in larger sizes up to a cavity of 16 5 mm x 6 1 mm ni780 header unmetallized frames enable shorter lead times and reduce manufacturing complexity. Ca pack packages convenient pre assembled ceramic package. Hermetic or vacuum sealing is typically applied to ensure device quality. Cupack packages unique design with very low thermal resistance.

Packages are available in surface mount designs as well as bolt down versions in dozens of open tooled designs. The traditional package for rf power transistors is the air cavity package with a ceramic lid. The flange or heatsink material has evolved over the years and the most commonly used material today is cpc cu mo70cu cu a laminate of copper and coppermolybdenum. Ceramic pin grid array packages cpga cpgas are typically a square ceramic multilayer package with an array of pins brazed onto either the front side of the package cavity down or on the backside of the package cavity up.

Ceramic air cavity packages proven performance for wireless applications.