Ceramic leadless chip carrier lcc national does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and national reserves the right at any time without notice to change said circuitry and specifications.
Ceramic chip carrier.
Variety of body sizes.
Solder glass or epoxy seal.
Tapepak plug family coinstack magazine.
Clcc ceramic leadless chip carrier mm inch unit.
Carrier outlines co family registration no.
Commercial quasi hermetic smt package.
17 84 lead ceramic leaded cl chip carrier with window square cerquad.
Plastic magazine family coinstack co 021.
Ceramic chip carrier cerquad family 68 lead ceramic leaded cl chip carrier with window square cerquad.
12 lead lcc 2 9mm x 2 9mm w ep e 12 4 pdf.
Some forms of chip carrier package are standardized in dimensions and registered with trade industry associations such as jedec.
Mm lead count pkg type or category cavity overall layer thickness ntk material code b black w white connection 0 non conect drawing no.
Leadless chip carriers are ideal for surface mount applications.
Other forms are proprietary.
Tapepak magazine family metal coinstack co 019.
Leadless ceramic smt packages and chip carriers with pctf for a direct pcb mount.
Chip carriers can be smaller than dual in line packages and since they use all four edges of the package they can have a larger pin count.
The external lead frame is formed into a j shape to allow for socketing or direct board soldering.
Low profile multilayer ceramic package.
I updated 10 05 ceramic chip carrier magazine type a b and d 68 pin leadless co 006.
18 small outline transistor family.
Castellations instead external leads.
The leadless chip carrier s low profile multilayer construction offers short internal electrical traces from the die to the metalized castellations around all sides and bottom of the package.
Chip carriers may be made of ceramic or plastic.
Plastic magazine plug family co 022.
Ceramic chip carrier.
Ceramic leaded chip carrier cqfj the ceramic quad flat pack continues to be popular in various surface mount applications.
Ceramic leadless chip carrier lcc jedec type leadless chip carriers continue their popularity for surface mount applications.
Footprint compatible with cqjb and plcc.
Package outline material information.
1st 2nd 3rd total seal ring die attach a x b c x d e x.
Leadless ceramic chip carrier legacy hittite package drawing e ey filter packages by entering lead count or product description into the search box below.
Fully hermetic smt package.
In high heat dissipation applications this proves to be an ideal package.