Ceramic Leadless Chip Carrier Socket

Castellations instead external leads.

Ceramic leadless chip carrier socket.

Surface mount and soldertail options are available. Heat sinks also available in six sizes. Leadless chip carriers are ideal for surface mount applications. Footprint compatible with cqjb and plcc.

Low profile multilayer ceramic package. Kyocera s multilayer division utilizes the most state of the art equipment combined with a knowledgeable technical staff to create high quality durable leadless chip carriers lcc. Surface mount and soldertail options are available. Gold or solder dip.

A socket for a leadless chip carrier said socket including a base member having a central opening therein a plurality of conductive resilient contacts for engaging conductive pads on said carrier each contact anchored in said base member and including an upwardly extending part said contacts positioned on at least two side edges of said base member opening and constituting opposing. 28 44 52 68 84 and 124. Prototypes and devices intended for extended temperature environments are typically packaged in ceramic while high volume products for consumer and commercial markets are typically packaged in plastic. Stainless steel spring latch is available in a variety of thicknesses to facilitate proper contact.

Leadless chip carrier sockets conform to jedec standards a b c and d. Leadless chip carrier sockets. Generally speaking sockets for plcc chips j lead are not compatible with leadless chip carriers since their contacts are typically recessed between fingers that align and grip the plcc package itself. A leadless chip carrier lcc has no leads but instead has rounded pins through the edges of the ceramic or molded plastic package.

Prototypes and devices intended for extended temperature environments are typically packaged in ceramic while high volume products for consumer and commercial markets are typically packaged in plastic. Variety of body sizes. A premolded plcc was originally released in 1976 but did not see much market adoption. Socket or surface mount package.

Contact is primarily made on the sides of the package not the bottom in order to take advantage of the wiping action. A leadless chip carrier lcc has no leads but instead has rounded pins through the edges of the ceramic or molded plastic package. Solder glass or epoxy seal. 28 44 52 68 84 and 124.

The lcc package is preferred where requirements call out for a low profile package or a surface mountable solderable package with low inductance to be used in. The chip is held into the socket by friction. Stainless steel spring latch is available in a variety of thicknesses to facilitate proper contact force with the socket. Heat sinks also available in six sizes.